Triangular semiconductor die



FIG. 1 is a perspective view of a triangular semiconductor die showing our new design;

FIG. 2 is an exploded perspective view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a side elevational view thereof;

FIG. 6 is another side elevational view thereof;

FIG. 7 is another side elevational view thereof; and,

FIG. 8 is another side elevational view thereof.

The broken lines in the figures represent unclaimed subject matter and form no part of the claimed design.

The triangular semiconductor die is shown broken away in FIGS. 1, 2, and 5-8 to indicate that no particular length is claimed. 

CLAIM The ornamental design for triangular semiconductor die, as shown and described. 